Police vehicle accidents and the impact such crashes have had on communities across New York State are the focus of a new data journalism project involving Newhouse School students working in partnership with reporters from the USA Today Network and Central Current….
Syracuse Law Hosts Information Event for Students Interested in Technology Commercialization Law Program
From start-ups to Fortune 100 companies, Syracuse Law’s Technology Commercialization Law Program (TCLP) partners with inventors who are passionate about bringing their technology to the marketplace. On Tuesday, Feb. 11, faculty and students from TCLP will meet to share information with prospective law students—from any undergraduate major—on the academic and career opportunities in this growing tech industry and working alongside these inventors. As one of the nation’s leading programs, TCLP combines classroom courses, real-world problem solving and applied research projects with a law degree to position graduates for a career in a growing field.
The TCLP has been at the forefront of practice-based technology law education since it was imagined by the College of Law 25 years ago. It has since graduated more than 300 alumni who work in law firms, government and technology transfer offices.
Emphasis will be placed on the fact that the program is open to students from any undergraduate major or professional background, and not just majors in the STEM fields.
“We give students an opportunity to think about the law in a real-life context, by learning about the technology and the business that surrounds the technology. You can’t be an effective lawyer if you don’t know your client’s business and don’t understand your client’s technology,” says Professor of Practice Jack Rudnick L’73.
The information session will begin at 5 p.m.in Heritage Alumni Lounge, outside of Grant Auditorium. Guests are asked to R.S.V.P. to email@example.com.
Dineen Hall, the new home of Syracuse Law, opens fall 2014. All TCLP courses and project work will be held in the new building.