Six Central New York businesses that are working to advance semiconductor manufacturing capabilities have received funding of more than $350,000 through the new NY THRIVE (Technology Hub for Revolutionary Innovation and Viable Ecosystems) Innovation Voucher program.

“Syracuse University is an economic engine in Central New York due to our strategic focus on strengthening partnerships, meeting the emerging needs of regional employers and preparing our students for the future,” says Mike Haynie, vice chancellor for strategic initiatives and innovation. “The NY THRIVE awards administered by the Collaboration and Commercialization Center are a prime example of how the University is stepping up to build the innovation economy of tomorrow in our community.”

The program provides companies with access to academic research capabilities, specialized equipment and faculty expertise to accelerate the development and commercialization of semiconductor technologies. It’s administered by the Syracuse University-led NY SMART I-Corridor’s Collaboration and Commercialization Center (C3), and includes partners Cornell University, Rochester Institute of Technology, University of Rochester and University at Buffalo.

“The NY THRIVE awards exemplify the power of industry-academic partnerships in advancing semiconductor manufacturing innovation,” says Duncan Brown, vice president for research and principal investigator of C3. “Syracuse University is proud to serve as a catalyst for technological advancement in New York’s growing semiconductor ecosystem. By connecting companies with world-class research facilities and faculty expertise, we’re helping to build the next generation of manufacturing capabilities that will strengthen our regional economy and position New York as a global leader in semiconductor innovation.”

NY THRIVE recipients are:

TTM Technologies Inc. (Syracuse) will collaborate with the research group led by Quinn Qiao, professor of mechanical and aerospace engineering in the College of Engineering and Computer Science (ECS), to evaluate sintering interface processing for printed circuit board manufacturing, investigating the effects on post-process state to improve interconnect reliability between adjacent layers.

TunaBotics (Syracuse) is leveraging R&D resources (space, equipment and personnel) at Syracuse University through the research group led by Wanliang Shan, associate professor of mechanical and aerospace engineering in ECS, to test prototypes of compliant robotic grippers for advanced electronics manufacturing applications.

IBEX Materials (Buffalo) will demonstrate the feasibility and effects of repurposing silicon waste from the semiconductor industry as a core feedstock for advanced lithium-ion battery anodes, addressing environmental impact reduction in semiconductor manufacturing.

Menlo Micro (Ithaca) will establish next-generation through-glass via (TGV) solutions for its microelectromechanical system (MEMS) switches, which are already in significant commercial use in RF, high-speed digital, quantum compute and AC/DC power applications, including AI data centers, industrial automation and building infrastructure. This award strengthens Menlo Micro’s market leadership and ongoing scaling efforts to advance glass substrate technologies critical for next-generation MEMS and microelectronic solutions.

OWiC Technologies (Ithaca) will scale up manufacturing of small photoelectronic electrochemical synthesizers (SPECS), breakthrough millimeter-scale wireless semiconductor devices for high-throughput electrosynthesis.

Photonect Interconnect Solutions Inc. (Rochester) will review and fabricate components for their prototype PIX-Attach, a first-of-its-kind, laser splicing system for high-volume photonic integration. The project will directly support prototyping, production-level V1 development and testing to enhance durability, precision and thermal stability.

“This first round of THRIVE Innovation Vouchers marks another important step in translating the NY SMART I-Corridor’s vision into tangible results for businesses across Upstate New York,” says Joseph Stefko, regional innovation officer for NY SMART I-Corridor Tech Hub. “By giving companies direct access to world-class research facilities, advanced equipment and technical expertise, we’re lowering barriers to commercialization and accelerating the growth of a stronger, more competitive semiconductor ecosystem. These vouchers don’t just support individual firms; they strengthen the entire innovation pipeline that is positioning Upstate New York as a national leader in semiconductor manufacturing, innovation and supply chain.”

About NY SMART I-Corridor

The NY SMART I-Corridor is a federally designated Tech Hub with a coalition of over 100 organizations—spanning businesses, higher education, economic development groups and community-based organizations. Together, they are positioning Upstate New York as a global leader in semiconductor manufacturing, innovation and workforce development.

The U.S. Economic Development Administration (EDA) Tech Hubs program, authorized by the CHIPS and Science Act, provides funding for regional technology development with matching support from the Empire State Development Division of Science, Technology and Innovation (NYSTAR).